Production Capacity

2100kft²/month

2600kft²/month

2700kft²/month

2700kft2/month

Layer (Mass Production)

1~26 Layers

1~30 Layers

1~32 Layers

Impedance Control

±8%

Minimum Thickness of CCL

3.5mil (including copper)

3.2mil (including copper)

3.0mil (including copper)

Board Thickness

6~240mil

6~260mil

6~280mil

5~280mil

Copper Clad Laminate

FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree)

FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree) &Thermal Prepreg &Aluminum/steel base

PCB external dimension tolerances (Routing)

±5mil

±4mil

Tolerances for PTH hole

±3mil

±2mil

±1mil

Tolerances for NPTH hole

±1mil

+0/-1mil

Inner etching

Min. Line/Space

3.5mil(A/W)

3mil (A/W)

2.5mil (A/W)

2.0mil(A/W)

Line Width tolerance

±10%

±8%

±5%

Board Thickness (Min.)

3.5 mil( including copper)

3.2 mil(including copper)

3.0 mil( including copper)

2.5mil (including very thin copper)

Plating Hole

Min. Hole Size

6mil

6mil(drill)

Aspect Ratio(max)

8

10

12

Position Accuracy

±2 mil

±1.5 mil

Microvia

Min Hole Size

4mil

3mil

Aspect Ration(max)

0.75:1

1:1

1.25:1

Outer Etching

Min. Line Width/ Space

3.5/3.5mil(A/W)

3/3mil(A/W)

2.8/2.8mil(A/W)

Line Width tolerance

±0.35 mil

±0.30 mil

Solder Mask

Bridge

3mil

Position Accuracy

1.5 mil

1.5mil

Press

Thickness Tolerance

10%

8%

<7%

Wrap/Twist

0.75%

0.60%

0.50%

<0.5%

Inner Opening(min)

(1)4/L:6mil;
(2)6/L-8/L:7mil;
(3)8/L or above:8mil

(1)4/L:5.5mil;
(2)6/L-8/L:7mil;
(3)8/L or above:8mil

(1)4/L:5mil;
(2)6/L-8/L:6mil;
(3)8/L or above:7mil

Feature		Year 2007	Year 2008	Year 2009	Year 2010
Production Capacity		2100kft²/month	2600kft²/month	2700kft²/month	2700kft2/month
Layer (Mass Production)		1~26 Layers	1~30 Layers	1~32 Layers	1~32 Layers
Impedance Control		±8%	±8%	±8%	±8%
Minimum Thickness of CCL		3.5mil (including copper)	3.2mil (including copper)	3.0mil (including copper)	3.0mil (including copper)
Board Thickness		6~240mil	6~260mil	6~280mil	5~280mil
Copper Clad Laminate		FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree)	FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree)	FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree)	FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4(Dciyfree) &Thermal Prepreg &Aluminum/steel base
PCB external dimension tolerances (Routing)		±5mil	±4mil	±4mil	±4mil
Tolerances for PTH hole		±3mil	±2mil	±2mil	±1mil
Tolerances for NPTH hole		±1mil	±1mil	+0/-1mil	+0/-1mil
Inner etching	Min. Line/Space	3.5mil(A/W)	3mil (A/W)	2.5mil (A/W)	2.0mil(A/W)
	Line Width tolerance	±10%	±8%	±8%	±5%
	Board Thickness (Min.)	3.5 mil( including copper)	3.2 mil(including copper)	3.0 mil( including copper)	2.5mil (including very thin copper)
Plating Hole	Min. Hole Size	6mil	6mil	6mil	6mil(drill)
	Aspect Ratio(max)	8	10	12	12
	Position Accuracy	±2 mil	±1.5 mil	±1.5 mil	±1.5 mil
Microvia	Min Hole Size	4mil	4mil	3mil	3mil
Microvia	Aspect Ration(max)	0.75:1	1:1	1.25:1	1.25:1
Outer Etching	Min. Line Width/ Space	3.5/3.5mil(A/W)	3/3mil(A/W)	3/3mil(A/W)	2.8/2.8mil(A/W)
Outer Etching	Line Width tolerance	±0.35 mil	±0.30 mil	±0.30 mil	±0.30 mil
Solder Mask	Bridge	3mil	3mil	3mil	3mil
Solder Mask	Position Accuracy	1.5 mil	1.5mil	1.5mil	1.5mil
Press	Thickness Tolerance	10%	8%	8%	<7%
	Wrap/Twist	0.75%	0.60%	0.50%	<0.5%
	Inner Opening(min)	(1)4/L:6mil; (2)6/L-8/L:7mil; (3)8/L or above:8mil	(1)4/L:5.5mil; (2)6/L-8/L:7mil; (3)8/L or above:8mil	(1)4/L:5mil; (2)6/L-8/L:6mil; (3)8/L or above:7mil	(1)4/L:5mil; (2)6/L-8/L:6mil; (3)8/L or above:7mil